Micro assembly

Exact placement with micro precision

Opto-electronic assemblies are efficiently and precisely mounted. Depending on the requirements, a precision of < 1 µm is realized. Typical processes include the placement of laser structures, VCSELs, photo diodes, PICs, modulators, optics, apertures and similar components.

According to the production volume, loading is performed manually or automated. The assembly techniques include gluing and UV curing, selective laser soldering, eutectic bonding and laser welding.