Nanosystec:
Products with a system

High performance systems with long lifetime – easy to integrate into existing lines

nanosystec delivers customized solutions for applications which require highest precision during assembly. We support our customers from feasibility testing to high volume serial production.

Active alignment with nano precision

Optimum coupling efficiency of opto-electronic components is performed by active alignment with a typical precision of < 100 nm. This applies to the one- and multi-channel adjustment of optics and optical fibers versus diode lasers and integrated photonic circuits.

With the OptoSpin option, alignment time is reduced to several seconds. Gluing with UV curing, laser welding or selective laser soldering fixes the optimum position permanently.

Exact placement with micro precision

Opto-electronic assemblies are efficiently and precisely mounted. Depending on the requirements, a precision of < 1 µm is realized. Typical processes include the placement of laser structures, VCSELs, photo diodes, PICs, modulators, optics, apertures and similar components.

According to the production volume, loading is performed manually or automated. The assembly techniques include gluing and UV curing, selective laser soldering, eutectic bonding and laser welding.

Opto-electronic characterization

All opto-electronic devices need to be measured for their key data. Typical values which need to be documented include power over current, spectral data such as wavelength and bandwidth, spatial characteristics of the laser beam, modulation grades and transmission functions.

In addition, the visual inspection indicates the quality and usability of the devices. All measurements data are recorded and can be used for further evaluation.

Laser balancing and fine cutting

Modern laser sources combined with state-of-the-art machine vision and precise motion systems are the prerequisite for fine laser balancing stations with precision material ablation as well as exact contours for precise cutting. Remaining imbalances of only several µgmm will be achieved.

The station will be equipped with a laser source which will provide an efficient and precise ablation for the material to be processed.

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Fine balancing & Micro Cutting

NanoBalancer

The fine balancing system NanoBalancer corrects smallest imbalances of rotating work pieces with laser ablation. The removal of material is performed either statically after the measurement or dynamically during the rotation of the work piece. Typical examples are impellers for technical or medical applications, airdriven turbines or small rotors of miniature motors.

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Active Alignment

NanoGlue

NanoGlue serves as the ideal assembly station for opto-electronic components, such as photonics circuits,waveguides, diode lasers and photodiodes as well as lenses and modulators. It provides active alignment in all six degrees of freedom followed by epoxy gluing with UV curing.

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Active Alignment, Electro-optical test

NanoHybrid

NanoHybrid provides a large degree of versatility. The active alignment, test and assembly station combines various assembly methods including gluing, laser welding or selective laser soldering. In addition, the station offers opto-electronic testing capability. Therefore, NanoHybrid is ideally suited for the development and small serial production in manufacturing companies or in research institutes.

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Active Alignment

NanoWelder

On the NanoWelder stations, an optical fiber or a receptacle is actively positioned versus a laser diode, a solid-state laser or a high-speed photodiode. These devices require assembly in the sub-micrometer-range.

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Fine balancing & Micro Cutting

VersaCut

The laser processing station VersaCut precisely ablates and cuts a large variety of materials, such as metals (stainless steel, nonferrous metals), ceramics like Si or AlN, and all kind of plastics. Depending on the indented use, the station uses different laser sources with the corresponding focusing optics. The modular VersaCut finds it application in research and production.

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Micro assembly

VersaGlue

The fully automated assembly station VersaGlue takes components, such as lenses or dies from a loading area and mounts them onto carrier devices. The assembly methods include epoxy gluing with UV or thermal curing as well as laser soldering and eutectic bonding.

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Micro assembly

VersaHybrid

VersaHybrid is a semi or fully automated production system for complex assemblies which require a precision in the low micrometer regime. Assembly techniques include micro welding, selective laser soldering and gluing plus laser fine cutting. Various processing methods are combined in one station. Feeders, belts and robots allow for full automation.

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Micro assembly

VersaSolder

The production system VersaSolder is a combination of laser-based selective soldering, optical systems and mechanical transport of the work pieces. The confi guration of the work station depends on the specifi c soldering task and the production fl ow. The modular design assures an optimal cost-performance ratio.

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Micro assembly

VersaWeld

Exactly tailored to the respective process requirements of the devices, VersaWeld provides high productivity from the beginning. The application determines which laser source will be used and thus stainless steel, Kovar, Titan alloys and nonferrous metals can be efficiently processed.

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Nanosystec

Nanosystec:
Products with a system

High performance systems with long lifetime – easy to integrate into existing lines

Active alignment with nano precision

Exact placement with micro precision

Opto-electronic characterization