Reliable optical fiber chip connections for cryogenic quantum hardware

Quantum computers impose the highest demands on optical and electrical connections. Components must be positioned with micrometer precision and at the same time withstand repeated temperature cycles between room temperature and a few Kelvin. Especially at the interface between the optical fiber and the chip, the quality of the connection determines stability, yield and scalability.

Conventional epoxy adhesives often reach their physical limits under cryogenic conditions. The significantly different thermal expansion of glass, glue, and semiconductor materials leads to mechanical stress, drift, and long-term degradation. However, permanently stable and controllable joints are required for reproducible quantum computer manufacturing.

Combination of active alignment and precise laser soldering process

Our NanoSolder is ideally suited to these requirements in micro-manufacturing. The system combines active alignment of the optical fiber in the sub-micrometer range with a precisely controlled laser soldering process. A SiO2 plate is positioned precise above the Si chip. The side facing away from the chip is metalized. The optical fiber, which is also metalized, is actively aligned in all three axis as well as on the polarization plane. The solder material is placed as a preform and melted using laser radiation. This creates a strong bond between the SiO2 cover plate and the optical fiber. This bond is insensitive to temperature changes and enables the quantum computer to operate reliably.

For developers and decision-makers in quantum computer manufacturing, our NanoSolder offers a robust, yield-stable solution for optical fiber chip connections. The system creates a resilient foundation for reproducible processes and scalable quantum hardware in demanding process environments.

Learn more about our NanoSolder laser soldering station here...