The reliable placement of devices in the micron range (< 10 µm) is standard for all of our stations. Historically, our expertise comes from active alignment in the nanometer range (< 100 nm) which is our daily business and supports our customers in various production environments.

Depending on the process requirements, our stations use different joining techniques (or combine them in one system): We use low-shift micro welding for durable connections, selective laser soldering as a complementary method to reflow, and epoxy gluing with UV curing in industrial manufacturing processes.

Our laser balancing systems process fast rotating parts in order to achieve extremely smooth operation, either in static or dynamic processes. The non-contact laser ablation provides fast, precise and reliable results.

OptoSpin combines the advantages of fast active alignment with the speed of passive assembly procedures. It aligns optical elements such as optical fibers, lenses, didoe lasers, VCSEL and photodiodes with the same coupling efficiency as conventional active alignment stations – but nearly as fast as passive placement.