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Events

LASER Munich

June 24 to 27, 2025
Booth A2.350

Precision Assembly and Active Alignment Stations: With up to 3 alignment stacks of 6 axes, the versatile NanoSeries Stations master every assembly task with epoxy gluing and curing, laser soldering and micro welding. Low-shift assembly procedures guarantee high yield for active alignment with sub-micron precision. Various signals (optical power, PER, wavelength, beam characteristics) serve as alignment feedback.

The modular system architecture allows for adapting the hardware configuration perfectly to the desired production process.

The concept of manual tray loading of the devices fulfills the requirements for small and medium production volumes. Feeders, belts and robots serve higher production volumes and the linking of various manufacturing systems.

Optoelectronic Test Stations: NanoTest performs optical and electrical characterization for Silicon Photonics Devices on wafer and chip level, VCSEL wafers, laser bars and CoS and High-Density PICs.

All NanoTest stations combine precise measurements with high speed, proven reliability and ease of use. The versatility qualifies the stations not only for high volume quality assurance, but also for demanding development applications. The graphic interface displays panels for system functions, such LIV curves, OSA measurement and S factors of the network measurements.

All measured data can be stored in a local database or transferred into the customer’s system.

Fine Cutting and Ablation Stations: Nanosystec offers customized precision systems with a high degree of automation for fine balancing and burr removal with laser radiation. Powerful machine vision and a XY scanner support reliable and automated manufacturing. High resolution machine vision algorithms guarantee the flawless recognition of even complex structures with a precision in the micrometer regime.

Compared to conventional techniques, laser-based material processing shows various advantages. Mechanical manufacturing processes such as drilling or milling often leave burrs affecting the functionality of the devices. In addition, these processes take time and are less precise.

ECOC Copenhagen

Sept. 29 to Oct. 1, 2025
Booth C1411

During ECOC, nanosystec demonstrates two set-ups for high-precision alignment and assembly.

NanoWeld is the proven alignment and welding system for high volume packaging of transmitters and receivers. Key features of the NanoWeld station are low weld shift and high repeatability. The system works with single and multi-channel coaxial and butterfly devices. The process time including loading/unloading can be as short as 25 seconds, depending on the device to be manufactured. Combined with OptoSpind and automated loading, even shorter cycle times will be reached.

NanoPlace is the ideal solution for manufacturing electro-optical subassemblies. The inherent precision allows positioning of diode laser, lenses, arrays, photo detectors and other optical elements with an error of less than 2µm. This error can be further reduced with active machine vision and sensors. The parts are then permanently fixed by gluing or laser soldering. NanoPlace addresses low and mid volume applications.

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nanosystec GmbH

Marie-Curie-Strasse 6
64823 Groß-Umstadt
DeutschlandGermany

TelefonFon+49 6078 78254 0
TelefaxFax: +49 6078 78254-10
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