Events

OFC San Diego
Booth #5439
During OFC 2025, nanosystec demonstrates two set-ups for high-precision alignment and assembly.
NanoWelder is the proven alignment and welding system for high volume packaging of transmitters and receivers. Key features of the NanoWelder station are low weld shift and high repeatability. The system works with single and multi-channel coaxial and butterfly devices. The process time including loading/unloading can be as short as 25 seconds, depending on the device to be manufactured. Combined with OptoSpin and automated loading, even shorter cycle times will be reached.
VersaHybrid is the ideal solution for manufacturing electro-optical subassemblies. The inherent precision allows positioning of diode laser, lenses, arrays, photo detectors and other optical elements with an error of less than 1µm. This error can be further reduced with active machine vision and sensors. The parts are then permanently fixed by gluing or laser soldering. VersaHybrid addresses low and mid volume applications.

LASER Munich
Booth A2.350
nanosystec presents high-precision laser-based production stations for micro assembly and fine cutting on LASER 2025 show in Munich (June 24 to 27), booth 350 in hall A2.
With up to 6 degrees of freedom and long-travel linear motor axes with encoders for position readout in the submicron range, the precision laser stations comply with complex geometries. As an additional option, a XY scanner deviates the laser beam to any position in a field of 100 mm x 100 mm within milliseconds.
Modern fiber laser sources offer up to 500 W cw power and create weld seams down to 20 µm width. In pulsed mode, such lasers provide high peak powers which allow for fine cutting. Diode laser modules provide the required power for selective laser soldering while lamp-pumped Nd:YAG lasers with multiple outputs server for low shift spot and seam welding.
The NanoSeries stations use high-precision epoxy gluing and laser soldering or welding (or a combination of various joining methods). NanoTest performs optical and electrical characterization for Silicon Photonics Devices on wafer and chip level, VCSEL wafers, laser bars and CoS and High-Density PICs.
The VersaSeries pick-and-place mounts opto-electronic assemblies and other precision devices with a precision between 1 µm and 10 µm. Typical processes include the placement of laser structures, optics, apertures and similar components requiring high accuracy. The assembly techniques include gluing and UV curing, selective laser soldering and hot bar soldering, eutectic bonding and laser welding.
Automated machine vision utilizes the images from the process optics and external cameras for motion control purposes, such as seam tracking and the recognition of difficult shapes, e. g. rotor blades. Device-specific machine vision algorithms reduce the processing time to a minimum.
The production systems work as a single station or can be integrated into production lines. Trays for single or multiple devices sets, robots, belts and feeders present the parts for processing and allow for the exchange with other work stations in the line.
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