VersaHybrid is the ideal solution for replacing tedious manual assembly procedures. Tailored to the specific assembly task, the station works with a semi or fully automated process placing and joining components with micron precision. Joining methods include epoxy gluing and UV curing, thermal curing, laser soldering and laser welding. Even cutting has been implemented. Several process steps with different joining technologies can be combined in one station. Typical applications are the manufacturing of complex optical assemblies, such as optical switches, external cavity lasers and many more.

VersaSolder-Blue works with blue light for melting the solder material. With an integrated temperature measurement and closed-loop control, a stable selective laser soldering process is guaranteed. Depending on the applicaton, other wavelengths in the near infrared can be chosen, especially for active alignment with nanometer precision.

NanoWeld is the proven alignment and welding system for high volume packaging of transmitters and receivers. Key features of the NanoWeld station are low weld shift and high repeatability. The system works with single and multi-channel coaxial and butterfly devices. The process time including loading/unloading can be as short as 25 seconds, depending on the device to be manufactured. Combined with OptoSpind and automated loading, even shorter cycle times will be reached.

NanoBond is the ideal solution for manufacturing electro-optical subassemblies. The inherent precision allows positioning of diode laser, lenses, arrays, photo detectors and other optical elements with an error of less than 1µm. This error can be further reduced with active machine vision and sensors. The parts are then permanently fixed by gluing or laser soldering. NanoBond addresses low and mid volume applications.

NanoWeld is the proven alignment and welding system for high volume packaging of transmitters and receivers. Key features of the NanoWeld station are low weld shift and high repeatability. The system works with single and multi-channel coaxial and butterfly devices. The process time including loading/unloading can be as short as 25 seconds, depending on the device to be manufactured. Combined with OptoSpind and automated loading, even shorter cycle times will be reached.

NanoBond is the ideal solution for manufacturing electro-optical subassemblies. The inherent precision allows positioning of diode laser, lenses, arrays, photo detectors and other optical elements with an error of less than 1µm. This error can be further reduced with active machine vision and sensors. The parts are then permanently fixed by gluing or laser soldering. NanoBond addresses low and mid volume applications.