Precision Assembly and Active Alignment Stations: With up to 3 alignment stacks of 6 axes, the versatile NanoSeries Stations master every assembly task with epoxy gluing and curing, laser soldering and micro welding. Low-shift assembly procedures guarantee high yield for active alignment with sub-micron precision. Various signals (optical power, PER, wavelength, beam characteristics) serve as alignment feedback.

The modular system architecture allows for adapting the hardware configuration perfectly to the desired production process.

The concept of manual tray loading of the devices fulfills the requirements for small and medium production volumes. Feeders, belts and robots serve higher production volumes and the linking of various manufacturing systems.

Optoelectronic Test Stations: NanoTest performs optical and electrical characterization for Silicon Photonics Devices on wafer and chip level, VCSEL wafers, laser bars and CoS and High-Density PICs.

All NanoTest stations combine precise measurements with high speed, proven reliability and ease of use. The versatility qualifies the stations not only for high volume quality assurance, but also for demanding development applications. The graphic interface displays panels for system functions, such LIV curves, OSA measurement and S factors of the network measurements.

All measured data can be stored in a local database or transferred into the customer’s system.

Fine Cutting and Ablation Stations: Nanosystec offers customized precision systems with a high degree of automation for fine balancing and burr removal with laser radiation. Powerful machine vision and a XY scanner support reliable and automated manufacturing. High resolution machine vision algorithms guarantee the flawless recognition of even complex structures with a precision in the micrometer regime.

Compared to conventional techniques, laser-based material processing shows various advantages. Mechanical manufacturing processes such as drilling or milling often leave burrs affecting the functionality of the devices. In addition, these processes take time and are less precise.