nanosystec offers customized systems for high-precision micro assembly and micro production technology.
We accompany our customers from the feasibility study to the device-specific high throughput production solution.
The NanoGlue systems combine precise pick and place with active or passive alignment of components which are attached by epoxy gluing. In case of active alignment, ultrafast routines cut process times to a minimum.
NanoPlace is a pick-and-place solution for manufacturing electro-optical subassemblies. The inherent precision allows positioning of diode laser, lenses, arrays, photo detectors and other optical elements with an error of less than 3µm.
Especially developed for the requirements of SiP wafers, the NanoTest SiP is used for the electrical and optical characterization of Silicon Photonics structures on wafer level. With optional packaging capability, the station is suited for different process levels.
Selective laser soldering is an ideal complement to standard reflow processes for all components which have to be attached after the reflow process. Another important field of application is the hermetic sealing of ceramic packages which contain heat-sensitive components.